Masana'antar Chip don ƙara 38 sabbin kayan kwalliyar 300mm nan da 2024
Saka hannun jari na 300mm a cikin 2020 zai haɓaka da kashi 13% na shekara-shekara (YoY) don rufe babban rikodin da aka saita a baya a cikin 2018 da kuma shigar da wata banner shekara don masana'antar semiconductor a cikin 2023, SEMI ta ruwaito a yau a cikin 300mm Fab Outlook zuwa 2024. Cutar sankarau ta COVID-19 ta haifar da karuwar kashe kudi ta 2020 ta hanyar hanzarta sauye-sauye na dijital a duk duniya, kuma ana sa ran karuwar zai iya zuwa 2021.
Ƙarfafa haɓaka yana haɓaka buƙatar sabis na girgije, sabobin, kwamfyutoci, wasan kwaikwayo da fasahar kiwon lafiya.Fasaha masu saurin haɓakawa irin su 5G, Intanet na Abubuwa (IoT), mota, hankali na wucin gadi (AI) da kuma koyon injin da ke ci gaba da haɓaka buƙatun haɗin kai, manyan cibiyoyin bayanai da manyan bayanai suma suna bayan haɓaka.
Ajit Manocha, shugaban SEMI kuma Shugaba na SEMI ya ce "Cutar COVID-19 tana haɓaka canjin dijital wanda ke mamaye kusan kowace masana'antar da ake tunanin za ta sake fasalin yadda muke aiki da rayuwa.""Hanyar kashe kudaden da aka yi hasashe da sabbin fasahohi 38 suna ƙarfafa rawar da masana'antun ke yi a matsayin ginshiƙi na manyan fasahohin da ke haifar da wannan sauyi da kuma yin alƙawarin taimakawa wajen magance wasu manyan ƙalubalen duniya."
Haɓaka a cikin saka hannun jari na semiconductor zai ci gaba a cikin 2021 amma a hankali a hankali na 4% YoY.Matsakaicin sake zagayowar masana'antu a baya, rahoton ya kuma annabta raguwa mai sauƙi a cikin 2022 da wani ɗan koma baya a cikin 2024 sakamakon rikodin dala biliyan 70 a cikin 2023.
Ƙara 38 Sabbin Fabs na 300mm
SEMI 300mm Fab Outlook zuwa 2024 yana nuna masana'antar guntu tana ƙara aƙalla sabbin kayan ƙira 38 na 300mm daga 2020 zuwa 2024, tsinkayen ra'ayin mazan jiya wanda baya haifar da ƙarancin yuwuwar ko jita-jita ayyukan fab.A cikin wannan lokacin, ƙarfin kayan aikin kowane wata zai girma da kusan wafers miliyan 1.8 don kaiwa sama da miliyan 7.
A karkashin wani babban yiwuwar aikin hasashe, masana'antu za su ƙara akalla 38 sabon 300mm girma fabs daga 2019 zuwa 2024. Taiwan za ta ƙara 11 girma fabs da Sin takwas zuwa lissafin rabin jimlar.Masana'antar guntu za ta ba da umarnin ƙirar ƙarar 161 300mm ta 2024.
Ci gaban Haɓaka Ta Sashin Samfura
Ƙwaƙwalwar ajiya ta ƙididdige yawan karuwar 300mm na kashe kuɗi.Haƙiƙanin saka hannun jari da hasashen hasashen yana nuna ci gaba a cikin manyan lambobi guda ɗaya na kowace shekara daga 2020 zuwa 2023, tare da haɓaka mai ƙarfi na 10% a cikin kantin sayar da kayayyaki don 2024.
DRAM da 3D NAND gudummawar zuwa 300mm fab ciyarwa ba zai zama m daga 2020 zuwa 2024. Zuba jari don dabaru / MPU, duk da haka, za su ga akai-akai ci gaba daga 2021 zuwa 2023. Power da alaka da na'urorin za su kasance a tsaye bangaren a 300mm fab zuba jari, tare da fiye da haka. 200% haɓaka a cikin 2021 kuma lambobi biyu yana ƙaruwa a cikin 2022 da 2023.
Bibiyar fabs da layukan 286 daga 2013 zuwa 2024, 300mm Fab Outlook zuwa 2024 yana nuna sabuntawa 247 zuwa fabs 104, sabbin fab da jerin layi, da sokewa biyu tun bayan buga rahoton Maris 2020.
Lokacin aikawa: 10-03-21